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Advanced Industrial Materials |
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|  Anisotropic Conductive Films (ACF) | Laser | Opto-Communication | Optical Media | Plasma Cleaner | RFID | Silicon Wafer | Substrate | UV Glue |
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Anisotropic Conductive Films (ACF) |
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Our anisotropic conductive films are used by the electronics industry, including specialty materials for TAB-on-glass, chip-on-glass, chip-on-film and general flipchip applications.
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Laser
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Laser diode is a key component for DVD, CD-R and MD. Whether you need a heatsink, a stem or a cap, or some other specialised component, Hitachi High-Technologies can supply it. Hitachi High-Technologies is a sales and marketing firm specialising in high technology products.
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Opto-Communication
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Device and Material for Opto-Communication
- Optical Isolator
- Ceramic Package
- Thermo Electric Cooler (TEC)
- Micro Lens
- Module Assy
- Silicon V Groove
- Assy by EMS
- PLC (Planner Light Wave Circuit)
- MEMS
- Opto-Com IC/LSI
- Laser Diode for DVD OPU
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Optical Media |
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Materials for DVDR
- Bonding Glue
- Silver Alloy Target
- Azo Dye
- Fluoro-Alcohol
- Spacer For DL
- Stamper
- Poly-Carbonate
Materials for CD & DVDRW
- Bonding Glue / UV Lacquer
- Aluminium Target
- Target for Protective & Memory Layer
- Stamper
- Poly-Carbonate
- Injection Molding Machine
- Handler
- Sputtering Machine
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Plasma Cleaner |
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This plasma cleaning system was developed to improve the bonding strength for wire bonding, the bonding strength for flip chip bonding, the filing capability for underfiling and the adhesiveness for resin searing.
Features:
- Multi-product small-scale production to mass production (The building block system made it possible to change your device from manual to automatic)
- Processing time : 12 to 30 seconds/board
- High Density and Large Area Processing (RF power source Max.600w, Processing area of 300mm)
- Plasma switching of PE and RIE is possible
- Plasma Processing in Wafer Level Package Process (4, 5, 6, 8inch Wafer)
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RFID |
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Toyo Aluminium No1 AL antenna supplier for Smart Card, Tag and EAS with competitive price.
Features:
- Multi-product Small-Scale Production to Mass Production (The building block system made it possible to change your device from manual one to automatic one)
- Original Crimping Process (not through hole plating)
- Plasma Processing in Wafer Level Package Process (4, 5, 6, 8inch Wafer)
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Silicon Wafer |
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Materials for Semiconductors, Flat Panels and Magnet
Semiconductor Materials for Front-End and Back-End Processes
Features:
- High Purity Silicon
- Compound Semiconductors
- Assembly Outsourcing
- Packing Materials
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Substrate |
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IC packaging substrates use ultra-thin core, micro-via drilling and high density pattern formation technologies and experiences which have been well developed over the years.
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UV Glue |
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Our coating solutions offer a precise balance of properties to ensure long-term reliability and end-use performance.
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Enquiries Contact |
| Contact Person (s) |
Richard Lim & Bernard Tan
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| Email |
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| TEL |
+65 6733-2754 |
| FAX |
+65 6735-3917
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| Enquiry |
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Related Links |
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Japan HQ Site (English) 
