|  Anisotropic Conductive Films (ACF) | Coil-on-Chip™ Technology | Electronic Components | Laser | Opto-Communication | Plasma Cleaner | Silicon Wafer | Solar | Substrate | UV Glue | Wiping Cloths/ Tape (KB Seiren Products |
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Anisotropic Conductive Films (ACF) |
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Our anisotropic conductive films are used by the electronics industry, including specialty materials for TAB-on-glass, chip-on-glass, chip-on-film and general flipchip applications.
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Coil-on-Chip™ Technology |
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Precision antenna coils mounted on the chip surface
With Maxell's original Electro Fine Forming technology, highly precise antenna coils can be mounted directly on the surface of silicon wafers. When compared to conventional 50mm-square contactless chips having external antenna coils, Coil-on-Chip™ RFID Systems rarely malfunction due to deterioration of contacts or mechanical stress, because there is no external soldering connection between the antenna coils and the chips.
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Electronic Components |
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Electronic Components consist of products as follows:
- DMC
- eRide
- Hard Disk Drives
- LCD
- LifeSize (Video Conference System)
- Nanxo LCD
- NEL (HDTV)
- Renesas
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Laser
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Laser diode is a key component for DVD, CD-R and MD. Whether you need a heatsink, a stem or a cap, or some other specialised component, Hitachi High-Technologies can supply it. Hitachi High-Technologies is a sales and marketing firm specialising in high technology products.
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Opto-Communication
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Device and Material for Opto-Communication
- Optical Isolator
- Ceramic Package
- Thermo Electric Cooler (TEC)
- Micro Lens
- Module Assy
- Silicon V Groove
- Assy by EMS
- PLC (Planner Light Wave Circuit)
- MEMS
- Opto-Com IC/LSI
- Laser Diode for DVD OPU
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Plasma Cleaner |
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This plasma cleaning system was developed to improve the bonding strength for wire bonding, the bonding strength for flip chip bonding, the filing capability for underfiling and the adhesiveness for resin searing.
Features:
- Multi-product small-scale production to mass production (The building block system made it possible to change your device from manual to automatic)
- Processing time : 12 to 30 seconds/board
- High Density and Large Area Processing (RF power source Max.600w, Processing area of 300mm)
- Plasma switching of PE and RIE is possible
- Plasma Processing in Wafer Level Package Process (4, 5, 6, 8inch Wafer)
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Silicon Wafer |
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Materials for Semiconductors, Flat Panels and Magnet
Semiconductor Materials for Front-End and Back-End Processes
Features:
- High Purity Silicon
- Compound Semiconductors
- Assembly Outsourcing
- Packing Materials
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Solar |
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We provide full range of materials in connection to the production of PV modules in the solar (renewable energy) industry.
Talk to us about:
- Backsheet
- EVA Film
- Cell
- Shield Glass
- Junction Box
- Hot-melt
- Wafer
- Cell Paste
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Substrate |
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IC packaging substrates use ultra-thin core, micro-via drilling and high density pattern formation technologies and experiences which have been well developed over the years.
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UV Glue |
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Our coating solutions offer a precise balance of properties to ensure long-term reliability and end-use performance.
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Wiping Cloths/ Tape (KB Seiren Products) |
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High technology fields are growing every day in sophistication and precision. In connection with this, high-performance wiping cloths are indispensable for a strict dust-free environment in the manufacturing of such products as LSIs and LCDs.
Clean room wipers play a vital role not only in cleaning workpieces, instruments, apparatuses and peripheral equipment without releasing lint, but also in absorbing and removing any undesired moisture.
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Enquiries Contact |
| Contact Person (s) |
Bernard Tan & Christopher Han |
| Email |
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| TEL |
+65 6733-2754 |
| FAX |
+65 6597-7240 |
| Enquiry |
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Related Links |
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Japan HQ Site (English) 
