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Semiconductor Manufacturing Equipment |
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Front-End
|  High Performance Advance CDSEM S-9380II / CG-4000 |
| Dark Field Wafer Defect Inspection System IS3000 | Defect Review SEM - RS Series | Electron Beam Wafer Inspection System I-6300 | Optical Wafer Inspection System HA-3000 | Unpatterned Wafer Inspection System LS-6800 |
| UHF-ECR Plasma Etch System U-8150 |
Back-End
| CSP/LOC Mounter CM-700 | Sip Bonder DB-700à SiP Bonder DB-800 |
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Front-end |
High Performance Advance CDSEM S-9380II / CG-4000
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Hitachi High Technologies Corporation with the *largest market share worldwide (*Data Quest 2005), produces the new model of CDSEM [CG4000] to attain the next generation process requirement. Hitachi’s most advanced CD-Measurement SEM, developed to master the mass production of the 65nm process node and to support process development of 45/32nm designs. Hitachi's well-known imaging capability combined with effective wafer charge control, superior measurement precision at high processing speed, dedicated flexible scanning for minimisation of ArF photoresist damage and sophisticated tool set monitoring routines enable precise and accurate control and monitoring of fine geometrical details on all types of process layers in today’s device manufacturing.
High accuracy CD-SEM for sub 45nm node and 300mm wafer process.
Features:
- High precision CD-measurement system for the latest process applications including ArF resist, charge-sensitive wafers, etc
- Equipment management & support system with auto-alignment and beam monitoring
- Realtime monitoring of process fluctuations
- New advanced software
Accessories – Terminal PC, off-line CD-SEM data analysis software:
- The Terminal PC package consists of 4 parts
- Transfer software for images and data
- Data Processing Software for data analysis and report generation under MS Excel
- Offline CD measurement software for PC
- Recipe error rate analysis function
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Dark Field Wafer Defect Inspection System IS3000
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Dark field wafer inspection system for 45nm generation. Effective for increasing yield by the high sensitivity / high speed inspection capabilities.
Features:
- Superior cost effective inspection tool
- DFC* discriminates under-layer defects from surface defects
- Recipe set up in minutes
- Precise coordinate system for SEM review
- DFC : Dark field classification
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Defect Review SEM - RS Series
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The RS-4000 is a dedicated high-speed Automatic Inline Classification SEM. Its design is targeted at the beginning for automatic defect classification, resulting in superior classification accuracy and purity.
The RS-4000 is based on the reliability of the W-W top selling Hitachi CD-SEM and features high image quality, high throughput, bare wafer review capability and EDS material analysis.
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Electron Beam Wafer Inspection System I-6300
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Electron beam wafer inspection system with high sensitivity and stable operation.
Features:
- Powerful for inspecting ultra fine pattern defects and electrical defects such as shorts or disconnections
- High speed and high sensitivity inspection
- Real-time Automatic Defect Classification function is available
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Optical Wafer Inspection System HA-3000
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The optical wafer inspection system is a pioneer for new technologies called nanometer generation for the next generation.
Features:
- High resolution is realised for 65nm generation device
- High sensitivity inspection for high density and microscopic pattern by DUV (Deep Ultra Violet) light system
- For multi-generation device.
- Capable of inspecting the next and after the next generation device
- Equipment concept is the best CoO in the market
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Unpatterned Wafer Inspection System LS-6800
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With its newly developed unique multi-directional detection optics unit, the LS-6800 / LS-7800 Wafer Surface Inspection tool achieves a detection sensitivity of 36nm (LSE) on bare silicon wafers. This enables critical wafer inspection even at the 65nm technology node.
Features:
- Detection Sensitivity: 40nm (PSL on Bare Silicon) (36nm attainable)
- Defect Classification: Crystal Defect / Particles Scratches/ Particles others
- Detection Reproducibility: >99% (100nm PSL on bare Si)
- Throughput (fast mode): 97wph (300mm) 75wph (200mm)
- Display functions: Particle map, counts, histogram, haze map, haze histogram, others
- Wafer sizes: 300mm, 200mm (150, 125, 100mm optional) (thin wafer chucking optional)
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UHF-ECR Plasma Etch System U-8150
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New 300mm UHF-ECR Plasma Etch System.
- New Silicon Etch System for improved WtW and WiW CD control targeting the 45 and 32nm technology nodes
- Improved design resulting in increased productivity and yield compared to U-7000 system
- Yield Enhancements: Symmetrical exhaust chamber / New material chamber / Multi-waves monitor / Advanced temperature controlled electrode
- Productivity Enhancements: High speed and low particle transfer system / Replaceable process chamber
- Multi-Chamber Platform
- 4-etch chambers available
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Back-End |
CSP/LOC Mounter CM-700
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High speed, High accuracy and Compact CSP/LOC Bonder for 300mm Wafer.
Features:
- High speed bonding (up to 3000UPH)
- Small foot print (x 0.77 CM-300)
- Applicable for BOC, micro BGA and LOC packages
- Applicable for 300mm and 200mm wafers
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Sip Bonder DB-700à SiP Bonder DB-800
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High speed and High accuracy flexible Die Bonder for SiP (System in Package) with 300mm wafer handling capability.
Features:
- World's smallest class of die bonder for 300mm wafer (Reducing size, light weight and low vibration design)
- High UPH is realised by new bonding head mechanism
- Response to stacked package production with multiple connection
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Enquiries Contact |
| Contact Person (s) |
Francis Khong & Gary Goh |
| Email |
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| TEL |
+65 6481-2050 |
| FAX |
+65 6481-8090 |
| Enquiry |
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Related Links |
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Japan HQ Site (English) 
