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Semiconductor Manufacturing Equipment |
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|  Dry Etching System | Metrology & Inspection | Assembly System |
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Dry Etching System |
UHF-ECR Plasma Etch System U-8150
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New 300mm UHF-ECR Plasma Etch System.
- New Silicon Etch System for improved WtW and WiW CD control targeting the 45 and 32nm tecnology nodes.
- Improved design resulting in increased productivity and yield compared to U-7000 system.
- Yield Enhancements
Symmetrical exhaust chamber / New material chamber / Multi-waves monitor / Advanced temperature controlled electrode
- Productivity Enhancements
High speed and low particle transfer system / Replaceable process chamber
- Multi-Chamber Platform.
4 etch chambers available
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Metrology & Inspection
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CD-Measurement SEM CG4000
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High performance CD-SEM for 45nm / 32nm generation and beyond.
Basic performance has been enhanced through the entirely improved platform of its predecessor S-9380 series CD-SEM to achieve an ever higher level of measurement accuracy. High accuracy process monitor, DBM (Design Based Metrology), and off-line recipe creation are available in conjunction with Hitachi "DesignGauge" system (option). We assure our customers of our continued support in yield enhancement by the newly introduced CG4000 CD-SEM for 45nm / 32nm generation and beyond. |
Application Support System
Design Based Metrology System DesignGauge
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Design Based Metrology System "DesignGauge" runs on a Windows(R) PC and can be connected with Hitachi CD-SEMs (S-9380II/CG4000) via an Ethernet connection to realize the new application, such as OPC* validation and off line recipe creation by using design data.
(*OPC : Optical Proximity Correction)
Windows is either registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or other countries.
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Defect Review SEM RS series
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Fast identification of root cause of defects for swift yield enhancement.
The Defect Review SEM is an automatic scanning electron beam defect review system which classifies killer defects at high speed and quickly feedbacks such problems.
Fast and high capture rate ADR (Automatic Defect Review) for DOI (Defect of Interest). Flexible and high accuracy ADC (Automatic Defect Classification) with systematic classification algorithms or user defined classification. EDX (Energy Dispersive X-ray Spectroscopy) and new optical microscope are available as an option. |
Wafer Surface Inspection System LS6800
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LS6800 are capable of detecting smaller than 40nm defects on unpatterned wafers with high sensitivity and throughput. Those tools support yield enhancement through high precision discrimination and detection of COP defects, particles, CMP scratches and particles.
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Dark Field Wafer Defect Inspection System IS3000
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Dark field wafer inspection system for 45nm generation
- Effective for yield enhancement by the high sensitivity / high speed inspection capabilities.
- Superior cost effective inspection tool.
- DFC (Dark field real time classification)
- Recipe set up in minutes.
- Precise coordinate system for SEM review.
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Assembly System |
Sip Bonder DB-700
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High speed and High accuracy flexible Die Bonder for SiP (System in Package) with 300mm wafer handling capability.
- World's smallest class of die bonder for 300mm wafer (Reducing size, light weight and low vibration design)
- High UPH is realized by new bonding head mechanism
- Response to stacked package production with multiple connection
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CSP/LOC Mounter CM-700
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High speed, High accuracy and Conpact CSP/LOC Bonder for 300mm Wafer.
- High speed bonding (up to 3000UPH)
- Small foot print. (x 0.77 CM-300)
- Applicable for BOC,
 BGA and LOC packages
- Applicable for 300mm and 200mm wafers
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Enquiries Contact |
| Contact Person (s) |
Michael Yip |
| Email |
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| TEL |
+65 6733-2754 |
| FAX |
+65 6597-7240 |
| Enquiry |
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Related Links |
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Japan HQ Site (English) 
